Invention Grant
- Patent Title: Image sensor and manufacturing method thereof
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Application No.: US17159147Application Date: 2021-01-27
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Publication No.: US11508772B2Publication Date: 2022-11-22
- Inventor: Chia-Wen Chiang , Hsiang-Hung Chang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW107143943 20181206
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/225

Abstract:
An image sensor including a substrate and an image sensing element is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit a contour of the arc surface. The image sensing element has a front surface and a rear surface opposite to the front surface and has at least one bonding wire, the bonding wire is connected between the front surface and the substrate, and the rear surface of the image sensing element directly contacts the arc surface. In addition, a manufacturing method of the image sensor is also provided.
Public/Granted literature
- US20210151491A1 IMAGE SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-05-20
Information query
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