公开(公告)号：US20220301980A1

公开(公告)日：2022-09-22

申请号：US17321536

申请日：2021-05-17

Applicant: Industrial Technology Research Institute

Inventor： Wei-Lan Chiu ,  Hsiang-Hung Chang

IPC: H01L23/48 ,  H01L21/768

Abstract: A through substrate via structure and a manufacturing method thereof, and a redistribution layer structure and a manufacturing method thereof are provided. The through substrate via structure includes a columnar conductive layer and a nanotwinned metal film disposed at least around the conductive layer. In a cross-section of the through substrate via structure, relative to a total area of the conductive layer and the nanotwinned metal film, an area ratio of the nanotwinned metal film is 50% or less by area.

公开(公告)号：US10361235B2

公开(公告)日：2019-07-23

申请号：US15391867

申请日：2016-12-28

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Shu Yang ,  Hsiang-Hung Chang

IPC: H01L27/146

Abstract: An image sensor including a substrate, an image sensing element, and an adhesive layer is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit the contour of the arc surface. The adhesive layer is disposed on the arc surface and encapsulates the image sensing element.

公开(公告)号：US20170052103A1

公开(公告)日：2017-02-23

申请号：US15245199

申请日：2016-08-24

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Cheng-Ta Ko ,  I-Hsing Lin ,  Hsiang-Hung Chang ,  Wen-Chih Chen

IPC: G01N15/06

Abstract: A miniaturized particulate matter detector that includes a filter and a concentration detector is provided. The filter has a plurality of holes, and the concentration detector is correspondingly disposed under the filter. The concentration detector has a detected area used to detect a concentration of at least one miniaturized particulate matter. A manufacturing method of the filter is also provided.

Abstract translation: 提供一种包括过滤器和浓度检测器的微型颗粒物检测器。 过滤器具有多个孔，并且浓度检测器相应地设置在过滤器下方。 浓度检测器具有用于检测至少一种小型化颗粒物质的浓度的检测区域。 还提供了一种过滤器的制造方法。

公开(公告)号：US20210151491A1

公开(公告)日：2021-05-20

申请号：US17159147

申请日：2021-01-27

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Hsiang-Hung Chang

IPC: H01L27/146 ,  H04N5/225

Abstract: An image sensor including a substrate and an image sensing element is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit a contour of the arc surface. The image sensing element has a front surface and a rear surface opposite to the front surface and has at least one bonding wire, the bonding wire is connected between the front surface and the substrate, and the rear surface of the image sensing element directly contacts the arc surface. In addition, a manufacturing method of the image sensor is also provided.

公开(公告)号：US20160043239A1

公开(公告)日：2016-02-11

申请号：US14919744

申请日：2015-10-22

Applicant: Industrial Technology Research Institute

Inventor： Hsiang-Hung Chang ,  Wen-Chih Chen ,  Chia-Wei Jui ,  Zhi-Cheng Hsiao ,  Cheng-Ta Ko ,  Rong-Shen Lee ,  Sheng-Shu Yang

IPC: H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02002 ,  H01L23/481 ,  H01L24/09 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L31/0203 ,  H01L2224/05009

Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.

Abstract translation: 提供适用于层叠半导体器件封装的导电插塞结构，其中可以实现导电插塞结构和相应的器件焊盘之间的大的接触区域，以减少电阻抗。 因此，使用导电插塞结构的诸如光敏器件封装的封装结构具有优异的电性能和可靠性。

公开(公告)号：US12087665B2

公开(公告)日：2024-09-10

申请号：US17321536

申请日：2021-05-17

Applicant: Industrial Technology Research Institute

Inventor： Wei-Lan Chiu ,  Hsiang-Hung Chang

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L23/481 ,  H01L21/76898

Abstract: A through substrate via structure and a manufacturing method thereof, and a redistribution layer structure and a manufacturing method thereof are provided. The through substrate via structure includes a columnar conductive layer and a nanotwinned metal film disposed at least around the conductive layer. In a cross-section of the through substrate via structure, relative to a total area of the conductive layer and the nanotwinned metal film, an area ratio of the nanotwinned metal film is 50% or less by area.

公开(公告)号：US11508772B2

公开(公告)日：2022-11-22

申请号：US17159147

申请日：2021-01-27

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Hsiang-Hung Chang

IPC: H01L27/146 ,  H04N5/225

Abstract: An image sensor including a substrate and an image sensing element is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit a contour of the arc surface. The image sensing element has a front surface and a rear surface opposite to the front surface and has at least one bonding wire, the bonding wire is connected between the front surface and the substrate, and the rear surface of the image sensing element directly contacts the arc surface. In addition, a manufacturing method of the image sensor is also provided.

公开(公告)号：US20180145107A1

公开(公告)日：2018-05-24

申请号：US15788816

申请日：2017-10-20

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Shu Yang ,  Hsiang-Hung Chang

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14607 ,  H01L27/14618 ,  H01L27/14643

Abstract: A manufacturing method of an image sensor. A substrate is provided, and the substrate has an arc surface. A cover, an adhesive layer, and an image sensing element are provided. The adhesive layer is bonded between the cover and the image sensing element. The cover, the adhesive layer, and the image sensing element bonded together are aligned to the substrate. The cover, the adhesive layer, and the image sensing element are pressed onto the substrate, such that the image sensing element is pressed by the adhesive layer and is thus curved to fit a contour of the arc surface, and the image sensing element is encapsulated by the adhesive layer.

公开(公告)号：US20180145106A1

公开(公告)日：2018-05-24

申请号：US15391867

申请日：2016-12-28

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Shu Yang ,  Hsiang-Hung Chang

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14607 ,  H01L27/14618 ,  H01L27/14643

Abstract: An image sensor including a substrate, an image sensing element, and an adhesive layer is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit the contour of the arc surface. The adhesive layer is disposed on the arc surface and encapsulates the image sensing element.

公开(公告)号：US10943938B2

公开(公告)日：2021-03-09

申请号：US16231958

申请日：2018-12-25

Applicant: Industrial Technology Research Institute

Inventor： Chia-Wen Chiang ,  Hsiang-Hung Chang

IPC: H01L27/146 ,  H01L31/0232 ,  H04N5/225

Abstract: An image sensor including a substrate and an image sensing element is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit a contour of the arc surface. The image sensing element has a front surface and a rear surface opposite to each other and has at least one first conductive via. The rear surface of the image sensing element directly contacts the arc surface, and the first conductive via is extended from the front surface to the rear surface. In addition, a manufacturing method of the image sensor is also provided.