Invention Grant
- Patent Title: Method and apparatus for reinstalling SIM profile in wireless communication system
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Application No.: US17039973Application Date: 2020-09-30
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Publication No.: US11510048B2Publication Date: 2022-11-22
- Inventor: Jonghan Park , Duckey Lee , Sujung Kang , Hyewon Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0122331 20191002
- Main IPC: H04W8/20
- IPC: H04W8/20 ; H04W8/18

Abstract:
The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services.
Public/Granted literature
- US20210105609A1 METHOD AND APPARATUS FOR REINSTALLING SIM PROFILE IN WIRELESS COMMUNICATION SYSTEM Public/Granted day:2021-04-08
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