Invention Grant
- Patent Title: Dual circuit digital isolator
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Application No.: US17067178Application Date: 2020-10-09
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Publication No.: US11515246B2Publication Date: 2022-11-29
- Inventor: Sundar Chetlur , Maxim Klebanov , Cory Voisine , Kenneth Snowdon , Hsuan-Jung Wu
- Applicant: Allegro MicroSystems, LLC
- Applicant Address: US NH Manchester
- Assignee: Allegro MicroSystems, LLC
- Current Assignee: Allegro MicroSystems, LLC
- Current Assignee Address: US NH Manchester
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/8234
Abstract:
An apparatus, comprising: a substrate; a coupling capacitor that is formed over the substrate; and an isolator that is formed between the substrate and the coupling capacitor, the isolator including: (a) an MP-well layer, (b) a first well layer, (c) an epi tub layer that is nested in the MP-well layer and the first well layer, and (d) a second well layer that is nested in the epi tub layer.
Public/Granted literature
- US20220115316A1 DUAL CIRCUIT DIGITAL ISOLATOR Public/Granted day:2022-04-14
Information query
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