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公开(公告)号:US20230084169A1
公开(公告)日:2023-03-16
申请号:US18051151
申请日:2022-10-31
Applicant: Allegro MicroSystems, LLC
Inventor: Sundar Chetlur , Maxim Klebanov , Cory Voisine , Kenneth Snowdon , Hsuan-Jung Wu
IPC: H01L23/522 , H01L21/8234
Abstract: An apparatus including; a substrate; an isolator that is formed over the substrate, the isolator including a silicon shield layer that is formed between a first buried oxide (BOX) layer and a second BOX layer; a silicon layer having an oxide trench structure formed therein, the oxide trench structure being arranged to define a first silicon island and a second silicon island; a first electronic circuit that is formed over the first silicon island; and a second electronic circuit that is formed over the second silicon island, the first electronic circuit being electrically coupled to the first electronic circuit.
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公开(公告)号:US11115244B2
公开(公告)日:2021-09-07
申请号:US16809825
申请日:2020-03-05
Applicant: Allegro MicroSystems, LLC
Inventor: Robert A. Briano , Pedram Sotoodeh Shahnani , Cory Voisine
Abstract: A signal isolator integrated circuit package includes a first circuit having a first input and a first output, a second circuit having a second input and a second output, an isolation barrier layer between the first circuit and the second circuit, wherein the second output of the second circuit is coupled to the first input of the first circuit through the isolation barrier. The signal isolator includes a comparator configured to compare the first input of the first circuit to the second output of the second circuit. The second output can be configured to convey at least three states, including a first state indicative of a logical high of an input signal received at the first input, a second state indicative of a logical low of the input signal, and a third state indicative of a fault condition.
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公开(公告)号:US12068237B2
公开(公告)日:2024-08-20
申请号:US18051151
申请日:2022-10-31
Applicant: Allegro MicroSystems, LLC
Inventor: Sundar Chetlur , Maxim Klebanov , Cory Voisine , Kenneth Snowdon , Hsuan-Jung Wu
IPC: H01L23/52 , H01L21/8234 , H01L23/522
CPC classification number: H01L23/5222 , H01L21/823493
Abstract: An apparatus including; a substrate; an isolator that is formed over the substrate, the isolator including a silicon shield layer that is formed between a first buried oxide (BOX) layer and a second BOX layer; a silicon layer having an oxide trench structure formed therein, the oxide trench structure being arranged to define a first silicon island and a second silicon island; a first electronic circuit that is formed over the first silicon island; and a second electronic circuit that is formed over the second silicon island, the first electronic circuit being electrically coupled to the first electronic circuit.
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公开(公告)号:US11515246B2
公开(公告)日:2022-11-29
申请号:US17067178
申请日:2020-10-09
Applicant: Allegro MicroSystems, LLC
Inventor: Sundar Chetlur , Maxim Klebanov , Cory Voisine , Kenneth Snowdon , Hsuan-Jung Wu
IPC: H01L23/522 , H01L21/8234
Abstract: An apparatus, comprising: a substrate; a coupling capacitor that is formed over the substrate; and an isolator that is formed between the substrate and the coupling capacitor, the isolator including: (a) an MP-well layer, (b) a first well layer, (c) an epi tub layer that is nested in the MP-well layer and the first well layer, and (d) a second well layer that is nested in the epi tub layer.
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公开(公告)号:US10718794B2
公开(公告)日:2020-07-21
申请号:US16013330
申请日:2018-06-20
Applicant: Allegro MicroSystems, LLC
Inventor: Georges El Bacha , Evan Shorman , Cory Voisine , Alexander Latham , William P. Taylor
Abstract: A current sensor integrated circuit including a magnetic field sensing element, a current conductor, an insulation structure, and a power calculation circuit is configured to meet safety isolation requirements. Isolation resistors allow for voltage from a high voltage side to be sensed at a low voltage side of the circuit. The insulation structure, current sensor package, and isolation resistors can achieve at least 500 Vrms isolation.
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公开(公告)号:US20220115316A1
公开(公告)日:2022-04-14
申请号:US17067178
申请日:2020-10-09
Applicant: Allegro MicroSystems, LLC
Inventor: Sundar Chetlur , Maxim Klebanov , Cory Voisine , Kenneth Snowdon , Hsuan-Jung Wu
IPC: H01L23/522 , H01L21/8234
Abstract: An apparatus, comprising: a substrate; a coupling capacitor that is formed over the substrate; and an isolator that is formed between the substrate and the coupling capacitor, the isolator including: (a) an MP-well layer, (b) a first well layer, (c) an epi tub layer that is nested in the MP-well layer and the first well layer, and (d) a second well layer that is nested in the epi tub layer.
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公开(公告)号:US20210083907A1
公开(公告)日:2021-03-18
申请号:US16809825
申请日:2020-03-05
Applicant: Allegro MicroSystems, LLC
Inventor: Robert A. Briano , Pedram Sotoodeh Shahnani , Cory Voisine
Abstract: A signal isolator integrated circuit package includes a first circuit having a first input and a first output, a second circuit having a second input and a second output, an isolation barrier layer between the first circuit and the second circuit, wherein the second output of the second circuit is coupled to the first input of the first circuit through the isolation barrier. The signal isolator includes a comparator configured to compare the first input of the first circuit to the second output of the second circuit. The second output can be configured to convey at least three states, including a first state indicative of a logical high of an input signal received at the first input, a second state indicative of a logical low of the input signal, and a third state indicative of a fault condition.
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公开(公告)号:US20190391185A1
公开(公告)日:2019-12-26
申请号:US16013330
申请日:2018-06-20
Applicant: Allegro MicroSystems, LLC
Inventor: Georges El Bacha , Evan Shorman , Cory Voisine , Alexander Latham , William P. Taylor
Abstract: A current sensor integrated circuit including a magnetic field sensing element, a current conductor, an insulation structure, and a power calculation circuit is configured to meet safety isolation requirements. The current sensor integrated circuit may include or be used with isolation resistors to allow for voltage from a high voltage side to be sensed at a low voltage side of the circuit. The insulation structure, current sensor package, and isolation resistors can achieve at least 500 Vrms isolation.
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公开(公告)号:US20190293694A1
公开(公告)日:2019-09-26
申请号:US15928689
申请日:2018-03-22
Applicant: Allegro MicroSystems, LLC
Inventor: Craig S. Petrie , Soo-Chang Choe , Cory Voisine
IPC: G01R19/165 , G01R15/20 , G01R19/25 , G01R19/252
Abstract: Systems and methods described herein provide a current sensor having fault detection circuitry configured to detect over-current and/or current faults corresponding to current through a conductor being greater than a predetermined level. The current sensor can include a shared signal path, a main signal path, and a fault detection signal path to perform both fault detection and current detection signal processing. The current sensor can include one or more magnetic field sensing elements configured to generate a magnetic field signal indicative of the current through the conductor, an analog-to-digital converter (ADC) configured to receive the magnetic field signal and convert the magnetic field signal into a digital signal, and a fault detector responsive to the digital signal to generate a fault signal indicative of the current through the conductor being greater than a predetermined level.
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