Invention Grant
- Patent Title: Enabling residue free gap fill between nanosheets
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Application No.: US16877574Application Date: 2020-05-19
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Publication No.: US11515431B2Publication Date: 2022-11-29
- Inventor: Indira Seshadri , Ekmini Anuja De Silva , Jing Guo , Ruqiang Bao , Muthumanickam Sankarapandian , Nelson Felix
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Intellectual Property Law
- Agent Thomas Grzesik
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/088 ; H01L29/06 ; H01L21/8234 ; H01L29/423 ; H01L29/10

Abstract:
A semiconductor structure and a method for fabricating the same. The semiconductor structure includes at least a first channel region and a second channel region. The first channel region and the second channel region each include metal gate structures surrounding a different nanosheet channel layer. The metal gate structures of the first and second channel regions are respectively separated from each other by an unfilled gap. The method includes forming a gap fill layer between and in contact with gate structures surrounding nanosheet channel layers in multiple channel regions. Then, after the gap fill layer has been formed for each nanosheet stack, a masking layer is formed over the gate structures and the gap fill layer in at least a first channel region. The gate structures and the gap fill layer in at least a second channel region remain exposed.
Public/Granted literature
- US20200279956A1 ENABLING RESIDUE FREE GAP FILL BETWEEN NANOSHEETS Public/Granted day:2020-09-03
Information query
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