Invention Grant
- Patent Title: Three-dimensional structure and method of manufacturing three-dimensional structure
-
Application No.: US16615037Application Date: 2018-04-11
-
Publication No.: US11518101B2Publication Date: 2022-12-06
- Inventor: Aya Shuto , Kenichi Kurihara , Nobuhiro Kihara , Yusuke Kajio , Tomomasa Watanabe
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPJP2017-099628 20170519
- International Application: PCT/JP2018/015204 WO 20180411
- International Announcement: WO2018/211871 WO 20181122
- Main IPC: B29C64/30
- IPC: B29C64/30 ; B33Y10/00 ; B33Y70/00 ; B33Y80/00 ; B33Y40/20 ; B29C64/147 ; B29K105/00

Abstract:
A three-dimensional structure according to an embodiment of the present disclosure includes: a plurality of resin layers including a light curable resin, the light curable resin including a coloring compound, a color developing-reducing agent, and a photothermal conversion agent, the plurality of resin layers being stacked, the color developing-reducing agent having an average particle diameter of 10 μm or more and 100 μm or less.
Public/Granted literature
- US20200207020A1 THREE-DIMENSIONAL STRUCTURE AND METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE Public/Granted day:2020-07-02
Information query