- 专利标题： Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof
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申请号： US16504917申请日： 2019-07-08
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公开(公告)号： US11521918B2公开(公告)日： 2022-12-06
- 发明人: Hyung Jun Cho , Kyoung Yeon Lee , Tae Yong Lee , Jae Min Bae
- 申请人： Amkor Technology Singapore Holding Pte. Ltd.
- 申请人地址： SG Singapore
- 专利权人： Amkor Technology Singapore Holding Pte. Ltd.
- 当前专利权人： Amkor Technology Singapore Holding Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Spectrum IP Law Group LLC
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/498
摘要：
In one example, a semiconductor device comprises a substrate and an electronic device on a top side of the substrate, a lead frame on the top side of the substrate over the electronic device, wherein the lead frame comprises a connection bar and a lead, a component mounted to the connection bar and the lead on a top side of the lead frame, and an encapsulant on the top side of the substrate, wherein the encapsulant contacts a side of the electronic device and a side of the component. Other examples and related methods are also disclosed herein.
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