Invention Grant
- Patent Title: Semiconductor structure and manufacturing method thereof
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Application No.: US17084639Application Date: 2020-10-30
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Publication No.: US11522129B2Publication Date: 2022-12-06
- Inventor: Chih-Wei Kuo
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN202011020940.9 20200925
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
The invention provides a semiconductor structure, the semiconductor structure includes a resistance random access memory (RRAM), a first spacer located at two sides of the RRAM, a second spacer located outside the first spacer, wherein the second spacer contains metal material or metal oxide material, and a third spacer located outside the second spacer.
Public/Granted literature
- US20220102629A1 Semiconductor structure and manufacturing method thereof Public/Granted day:2022-03-31
Information query
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