Invention Grant
- Patent Title: Method of manufacturing electronic devices and corresponding electronic device
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Application No.: US16834042Application Date: 2020-03-30
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Publication No.: US11524892B2Publication Date: 2022-12-13
- Inventor: Kevin Formosa , Marco Del Sarto
- Applicant: STMicroelectronics (Malta) Ltd , STMicroelectronics S.r.l.
- Applicant Address: MT Kirkop; IT Agrate Brianza
- Assignee: STMicroelectronics (Malta) Ltd,STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics (Malta) Ltd,STMicroelectronics S.r.l.
- Current Assignee Address: MT Kirkop; IT Agrate Brianza
- Agency: Crowe & Dunlevy
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00

Abstract:
A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.
Public/Granted literature
- US20200307994A1 METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTRONIC DEVICE Public/Granted day:2020-10-01
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