Invention Grant
- Patent Title: Actuating and sensing module
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Application No.: US17230058Application Date: 2021-04-14
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Publication No.: US11525439B2Publication Date: 2022-12-13
- Inventor: Hao-Jan Mou , Shih-Chang Chen , Jia-Yu Liao , Hung-Hsin Liao , Chung-Wei Kao , Chi-Feng Huang , Yung-Lung Han , Chang-Yen Tsai , Yang Ku
- Applicant: Microjet Technology Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Microjet Technology Co., Ltd.
- Current Assignee: Microjet Technology Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW109113928 20200424
- Main IPC: F04B43/04
- IPC: F04B43/04 ; F16K7/00 ; G01F1/34 ; F04B43/00 ; F04B49/03

Abstract:
An actuating and sensing module is disclosed and includes a bottom plate, terminals, a control chip, a partition plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes terminal grooves, a recess, a gas outlet and a gas relief aperture. The terminals are disposed in the terminal grooves. The control chip is disposed in the recess. The partition plate is stacked on the bottom plate and includes an outlet opening in communication with the gas outlet and a pressure relief orifice corresponding to the gas relief aperture. The thin gas transportation device seals the gas outlet and the pressure relief orifice. The cover plate includes an opening passed through by the thin gas transportation device. The gas is transported to the outlet opening by the thin gas transportation device and sensed by the gas pressure sensor disposed in the outlet opening.
Public/Granted literature
- US20210332810A1 ACTUATING AND SENSING MODULE Public/Granted day:2021-10-28
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