- 专利标题: Printed circuit board
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申请号: US17117307申请日: 2020-12-10
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公开(公告)号: US11528804B2公开(公告)日: 2022-12-13
- 发明人: Ga Young Yoo , Mi Sun Hwang , Jun Hyeong Jang
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2020-0125666 20200928
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/11 ; H05K1/18
摘要:
A printed circuit board includes: an insulating layer; and a first circuit layer disposed on an upper surface of the insulating layer. A lower surface of the first circuit layer is in contact with at least a portion of the insulating layer, and the first circuit layer includes a first region embedded in the insulating layer, and a second region protruding from the upper surface of the insulating layer.
公开/授权文献
- US20220104345A1 PRINTED CIRCUIT BOARD 公开/授权日:2022-03-31