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公开(公告)号：US11076487B2
公开(公告)日：2021-07-27
申请号：US16820172
申请日：2020-03-16
发明人： Mi Sun Hwang , Deok Man Kang , Jun Hyeong Jang
IPC分类号： H05K1/18
摘要： An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and a stopper layer. An electronic component is disposed in the cavity. The stopper layer includes a first metal layer embedded in the first insulating body and having a portion of an inner surface exposed from the first insulating body, and a second metal layer disposed below the first metal layer and having at least a portion of an upper surface disposed as a bottom surface of the cavity. The cavity has an inner surface of the first metal layer and an inner surface of the first insulating body as a first wall surface and a second wall surface, respectively, and an inclination of the first wall surface is different from an inclination of the second wall surface.
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公开(公告)号：US11528804B2
公开(公告)日：2022-12-13
申请号：US17117307
申请日：2020-12-10
发明人： Ga Young Yoo , Mi Sun Hwang , Jun Hyeong Jang
摘要： A printed circuit board includes: an insulating layer; and a first circuit layer disposed on an upper surface of the insulating layer. A lower surface of the first circuit layer is in contact with at least a portion of the insulating layer, and the first circuit layer includes a first region embedded in the insulating layer, and a second region protruding from the upper surface of the insulating layer.
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公开(公告)号：US11183462B2
公开(公告)日：2021-11-23
申请号：US16809925
申请日：2020-03-05
发明人： Mi Sun Hwang , Dae Jung Byun , Chang Hwa Park , Sang Ho Jeong , Jun Hyeong Jang , Ki Ho Na , Je Sang Park , Yong Duk Lee , Yoo Rim Cha , Yeo Il Park
IPC分类号： H01L23/538 , H01L23/00
摘要： A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.
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公开(公告)号：US11640952B2
公开(公告)日：2023-05-02
申请号：US16804421
申请日：2020-02-28
发明人： Mi Sun Hwang , Dae Jung Byun , Chang Hwa Park , Sang Ho Jeong , Jun Hyeong Jang , Ki Ho Na , Je Sang Park , Yong Duk Lee , Yoo Rim Cha , Yeo Il Park
IPC分类号： H01L23/538 , H01L23/00 , H01L21/48 , H01L21/56 , H01L23/498
摘要： An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.
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公开(公告)号：US20210193609A1
公开(公告)日：2021-06-24
申请号：US16804421
申请日：2020-02-28
发明人： Mi Sun Hwang , Dae Jung Byun , Chang Hwa Park , Sang Ho Jeong , Jun Hyeong Jang , Ki Ho Na , Je Sang Park , Yong Duk Lee , Yoo Rim Cha , Yeo Il Park
IPC分类号： H01L23/00 , H01L21/48 , H01L23/538 , H01L21/56 , H01L23/498
摘要： An electronic component embedded substrate includes a core structure including a first insulating body and core wiring layers and having a cavity and having a stopper layer disposed as a bottom surface; an electronic component disposed in the cavity and attached to the stopper layer; and a build-up structure including a second insulating body covering at least a portion each of the core structure and the electronic component and filling at least a portion of the cavity, and build-up wiring layers wherein the stopper layer has a first region in which a portion of one surface is exposed from the first insulating body and a second region in which the other portion of one surface is covered with the first insulating body, and a surface roughness of one surface of the stopper layer in the first region is greater than that of the stopper layer in the second region.
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