• Patent Title: Mold molding apparatus and method for controlling mold molding apparatus
  • Application No.: US17050126
    Application Date: 2019-04-25
  • Publication No.: US11529675B2
    Publication Date: 2022-12-20
  • Inventor: Shuji TakasuTakehiro Sugino
  • Applicant: SINTOKOGIO, LTD.
  • Applicant Address: JP Nagoya
  • Assignee: SINTOKOGIO, LTD.
  • Current Assignee: SINTOKOGIO, LTD.
  • Current Assignee Address: JP Nagoya
  • Agency: Oliff PLC
  • Priority: JPJP2018-114247 20180615
  • International Application: PCT/JP2019/017598 WO 20190425
  • International Announcement: WO2019/239733 WO 20191219
  • Main IPC: B22C19/04
  • IPC: B22C19/04 B22C11/04
Mold molding apparatus and method for controlling mold molding apparatus
Abstract:
A mold molding apparatus can successively mold casting molds having the necessary casting mold strength, and a method for controlling the mold molding apparatus. A molding sensor measures a pressure of molding sand exerted on a surface of one or both of a pattern plate and a squeeze foot, or on a surface of one or both of a pattern plate and a squeeze board; and a control device that controls operation of the mold molding apparatus based on outputs from the molding sensors.
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