Invention Grant
- Patent Title: Mold molding apparatus and method for controlling mold molding apparatus
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Application No.: US17050126Application Date: 2019-04-25
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Publication No.: US11529675B2Publication Date: 2022-12-20
- Inventor: Shuji Takasu , Takehiro Sugino
- Applicant: SINTOKOGIO, LTD.
- Applicant Address: JP Nagoya
- Assignee: SINTOKOGIO, LTD.
- Current Assignee: SINTOKOGIO, LTD.
- Current Assignee Address: JP Nagoya
- Agency: Oliff PLC
- Priority: JPJP2018-114247 20180615
- International Application: PCT/JP2019/017598 WO 20190425
- International Announcement: WO2019/239733 WO 20191219
- Main IPC: B22C19/04
- IPC: B22C19/04 ; B22C11/04

Abstract:
A mold molding apparatus can successively mold casting molds having the necessary casting mold strength, and a method for controlling the mold molding apparatus. A molding sensor measures a pressure of molding sand exerted on a surface of one or both of a pattern plate and a squeeze foot, or on a surface of one or both of a pattern plate and a squeeze board; and a control device that controls operation of the mold molding apparatus based on outputs from the molding sensors.
Public/Granted literature
- US11660664B2 Mold molding apparatus and method for controlling mold molding apparatus Public/Granted day:2023-05-30
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