公开(公告)号：US11660664B2

公开(公告)日：2023-05-30

申请号：US17050126

申请日：2019-04-25

Applicant: SINTOKOGIO, LTD.

Inventor： Shuji Takasu ,  Takehiro Sugino

IPC: B22C19/04 ,  B22C11/04

CPC classification number: B22C19/04 ,  B22C11/04

Abstract: A mold molding apparatus can successively mold casting molds having the necessary casting mold strength, and a method for controlling the mold molding apparatus. A molding sensor measures a pressure of molding sand exerted on a surface of one or both of a pattern plate and a squeeze foot, or on a surface of one or both of a pattern plate and a squeeze board; and a control device that controls operation of the mold molding apparatus based on outputs from the molding sensors.

公开(公告)号：US11597003B2

公开(公告)日：2023-03-07

申请号：US17050126

申请日：2019-04-25

Applicant: SINTOKOGIO, LTD.

Inventor： Shuji Takasu ,  Takehiro Sugino

IPC: B22C19/04 ,  B22C11/04

Abstract: A mold molding apparatus can successively mold casting molds having the necessary casting mold strength, and a method for controlling the mold molding apparatus. A molding sensor measures a pressure of molding sand exerted on a surface of one or both of a pattern plate and a squeeze foot, or on a surface of one or both of a pattern plate and a squeeze board; and a control device that controls operation of the mold molding apparatus based on outputs from the molding sensors.

公开(公告)号：US11628490B2

公开(公告)日：2023-04-18

申请号：US17050126

申请日：2019-04-25

Applicant: SINTOKOGIO, LTD.

Inventor： Shuji Takasu ,  Takehiro Sugino

IPC: B22C19/04 ,  B22C11/04

Abstract: A mold molding apparatus can successively mold casting molds having the necessary casting mold strength, and a method for controlling the mold molding apparatus. A molding sensor measures a pressure of molding sand exerted on a surface of one or both of a pattern plate and a squeeze foot, or on a surface of one or both of a pattern plate and a squeeze board; and a control device that controls operation of the mold molding apparatus based on outputs from the molding sensors.

公开(公告)号：US11045866B2

公开(公告)日：2021-06-29

申请号：US16965871

申请日：2018-11-15

Applicant: Sintokogio, Ltd.

Inventor： Takashi Hanai ,  Takehiro Sugino ,  Kazunori Ogura ,  Yoshimitsu Ichino ,  Shuji Takasu

IPC: B22C19/04 ,  B22C21/10 ,  B22D46/00 ,  B22D47/02

Abstract: A method is provided for measuring a shift between a carrier for a pattern (a carrier plate) and a flask and preventing a defect caused by a shift in the cavity parts. The method for preventing a defect caused by the shift in the cavity parts in molding a cope and a drag with flasks by using a cope flask (110) that is assembled with a carrier plate (130) for the cope flask and a drag flask (120) that is assembled with a carrier plate (140) for the drag flask, comprises the steps of measuring a shift between the carrier plate (130) for the cope flask and the cope flask (110), measuring a shift between the carrier plate (140) for the drag flask and the drag flask (120), measuring a shift between the cope flask (110) and the drag flask (120) that have been assembled, determining if a shift in cavity parts is within an allowable range, wherein the data on the shift is obtained based on the shift between the carrier plate (130) for the cope flask and the cope flask (110), the shift between the carrier plate (140) for the drag flask and the drag flask (120), and the shift between the cope flask (110) and the drag flask (120, that have been assembled.

公开(公告)号：US11529675B2

公开(公告)日：2022-12-20

申请号：US17050126

申请日：2019-04-25

Applicant: SINTOKOGIO, LTD.

Inventor： Shuji Takasu ,  Takehiro Sugino

IPC: B22C19/04 ,  B22C11/04

Abstract: A mold molding apparatus can successively mold casting molds having the necessary casting mold strength, and a method for controlling the mold molding apparatus. A molding sensor measures a pressure of molding sand exerted on a surface of one or both of a pattern plate and a squeeze foot, or on a surface of one or both of a pattern plate and a squeeze board; and a control device that controls operation of the mold molding apparatus based on outputs from the molding sensors.

公开(公告)号：US09857493B2

公开(公告)日：2018-01-02

申请号：US14654902

申请日：2013-08-05

Applicant: SINTOKOGIO, LTD.

Inventor： Hiroyasu Makino ,  Minoru Hirata ,  Shuji Takasu ,  Hiroyuki Miyazaki ,  Matthias Strehle

IPC: G01V3/02 ,  B22C9/02 ,  B22C19/00 ,  G01F23/24 ,  B22C19/04 ,  B22C15/02

CPC classification number: G01V3/02 ,  B22C9/02 ,  B22C15/02 ,  B22C19/00 ,  B22C19/04 ,  G01F23/242

Abstract: A method for detecting powder is performed in a powder detection device including a pair of electrodes arranged to be opposed to each other with a gap interposed therebetween and an electric circuit electrically connected to the pair of electrodes. The method includes detecting powder filling in a case where the electric circuit together with powder and the electrodes forms a closed circuit when the powder fills the gap.