Invention Grant
- Patent Title: Thermal undercut structure for metasurface tuning
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Application No.: US16944005Application Date: 2020-07-30
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Publication No.: US11531146B2Publication Date: 2022-12-20
- Inventor: Aditya Jain , Zoran Jandric , Dan Mohr , Kevin A. Gomez , Krishnan Subramanian
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Fremont
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Fremont
- Agency: Holzer Patel Drennan
- Main IPC: G02B5/00
- IPC: G02B5/00 ; G02B1/00 ; G02F1/313 ; G02F1/29

Abstract:
An active metasurface includes a number of periodically-repeated unit cells arranged on a substrate, each of the unit cells including a high-index dielectric block; a heat source positioned to selectively modulate heat applied to the high-index dielectric block; and an insulating undercut region at an interface between the high-index dielectric block and the substrate.
Public/Granted literature
- US20210181594A1 THERMAL UNDERCUT STRUCTURE FOR METASURFACE TUNING Public/Granted day:2021-06-17
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