Invention Grant
- Patent Title: Integrated circuit structure with metal gate and metal field plate having coplanar upper surfaces
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Application No.: US17206195Application Date: 2021-03-19
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Publication No.: US11532742B2Publication Date: 2022-12-20
- Inventor: Ketankumar Harishbhai Tailor , Peter Baars
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/40 ; H01L21/8238 ; H01L27/092 ; H01L29/423 ; H01L29/66

Abstract:
An integrated circuit (IC) structure and a field plate are disclosed. The IC structure and field plate may find advantageous application with, for example, extended drain metal-oxide semiconductor (EDMOS) transistors. The IC structure includes a transistor including a metal gate structure and a drain extension region extending laterally from partially under the metal gate structure to a drain region. A metal field plate is over the drain extension region. Due to being formed simultaneously as part of a gate-last formation approach, the metal field plate has an upper surface coplanar with an upper surface of the metal gate structure. A field plate contact may be on the metal field plate.
Public/Granted literature
- US20220302306A1 INTEGRATED CIRCUIT STRUCTURE WITH METAL GATE AND METAL FIELD PLATE HAVING COPLANAR UPPER SURFACES Public/Granted day:2022-09-22
Information query
IPC分类: