- Patent Title: Microstrip line structures having multiple wiring layers and including plural wiring structures extending from one wiring layer to a shield on a different wiring layer
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Application No.: US17211044Application Date: 2021-03-24
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Publication No.: US11532864B2Publication Date: 2022-12-20
- Inventor: Hanyi Ding
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01P11/00
Abstract:
Structures for a microstrip transmission line and methods of forming a microstrip transmission line. The microstrip transmission line includes a signal line, a shield, and multiple wiring structures connected to the signal line. Each wiring structure extends from a portion of the signal line toward the shield, and each wiring structure includes a metal feature that is positioned adjacent to the shield.
Public/Granted literature
- US20220311116A1 MICROSTRIP TRANSMISSION LINES WITH INDUCTIVE AND CAPACITIVE SECTIONS Public/Granted day:2022-09-29
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