公开(公告)号：US11204463B1

公开(公告)日：2021-12-21

申请号：US16931771

申请日：2020-07-17

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Benjamin V. Fasano ,  Andreas D. Stricker ,  Hanyi Ding ,  Yusheng Bian ,  Bo Peng

IPC: G02B6/122 ,  G02B6/12

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including an optical medium for light signals; and an optical grating coupler coupled to the optical medium. The optical grating coupler is configured to reorient light from the optical medium. A cladding material is over the optical grating coupler. An absorber layer is over the cladding material, and vertically above the optical grating coupler.

公开(公告)号：US11002763B2

公开(公告)日：2021-05-11

申请号：US16100297

申请日：2018-08-10

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Ye Wang ,  Hanyi Ding ,  Timothy M. Platt

IPC: G01R1/073 ,  G01R1/067

Abstract: Embodiments of the disclosure provide a probe structured for electrical and photonics testing of a photonic integrated circuit (PIC) die, the probe including: a membrane having a first surface and an opposing second surface and including conductive traces, the membrane being configured for electrical coupling to a probe interface board (PIB); a set of probe tips positioned on the membrane, the set of probe tips being configured to send electrical test signals to the PIC die or receive electrical test signals from the PIC die; and a photonic test assembly disposed on the membrane and electrically coupled to the conductive traces of the membrane, the photonic test assembly positioned for substantial alignment with a photonic I/O element of the PIC die, wherein the photonic test assembly is configured to transmit a photonic input signal to the photonic I/O element or detect a photonic output signal from the photonic I/O element.

公开(公告)号：US12222257B2

公开(公告)日：2025-02-11

申请号：US17657175

申请日：2022-03-30

Applicant: GlobalFoundries U.S. Inc.

Inventor： Hanyi Ding ,  Aidong Yan ,  Rongtao Cao

IPC: G01M11/00 ,  G02B6/42

Abstract: A structure for testing a photodiode in a PIC using a grating coupler in optical communication with an optical terminal in a different location of the photodiode from another optical terminal used during operation of the PIC. The photodiode includes an operational optical terminal and a test optical terminal with the test optical terminal in a different location than the operational optical terminal. An optical component is in optical communication with the operational optical terminal of the photodiode and is used during operation of the photodiode and the PIC. A grating coupler is in optical communication with the test optical terminal of the photodiode for testing purposes.

公开(公告)号：US20230314274A1

公开(公告)日：2023-10-05

申请号：US17657175

申请日：2022-03-30

Applicant: GlobalFoundries U.S. Inc.

Inventor： Hanyi Ding ,  Aidong Yan ,  Rongtao Cao

IPC: G01M11/00 ,  G02B6/42

CPC classification number: G01M11/00 ,  G02B6/4206

Abstract: A structure for testing a photodiode in a PIC using a grating coupler in optical communication with an optical terminal in a different location of the photodiode from another optical terminal used during operation of the PIC. The photodiode includes an operational optical terminal and a test optical terminal with the test optical terminal in a different location than the operational optical terminal. An optical component is in optical communication with the operational optical terminal of the photodiode and is used during operation of the photodiode and the PIC. A grating coupler is in optical communication with the test optical terminal of the photodiode for testing purposes.

公开(公告)号：US20220311116A1

公开(公告)日：2022-09-29

申请号：US17211044

申请日：2021-03-24

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Hanyi Ding

IPC: H01P3/08 ,  H01P11/00

Abstract: Structures for a microstrip transmission line and methods of forming a microstrip transmission line. The microstrip transmission line includes a signal line, a shield, and multiple wiring structures connected to the signal line. Each wiring structure extends from a portion of the signal line toward the shield, and each wiring structure includes a metal feature that is positioned adjacent to the shield.

公开(公告)号：US20220057575A1

公开(公告)日：2022-02-24

申请号：US17453533

申请日：2021-11-04

Applicant: GlobalFoundries U.S. Inc.

Inventor： Benjamin V. Fasano ,  Andreas D. Stricker ,  Hanyi Ding ,  Yusheng Bian ,  Bo Peng

IPC: G02B6/122

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including an absorber layer separated from an optical grating coupler by a cladding material. The absorber is positioned to receive light reoriented through the optical grating coupler.

公开(公告)号：US11536900B2

公开(公告)日：2022-12-27

申请号：US17453533

申请日：2021-11-04

Applicant: GlobalFoundries U.S. Inc.

Inventor： Benjamin V. Fasano ,  Andreas D. Stricker ,  Hanyi Ding ,  Yusheng Bian ,  Bo Peng

IPC: G02B6/122 ,  G02B6/12

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including an absorber layer separated from an optical grating coupler by a cladding material. The absorber is positioned to receive light reoriented through the optical grating coupler.

公开(公告)号：US11532864B2

公开(公告)日：2022-12-20

申请号：US17211044

申请日：2021-03-24

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Hanyi Ding

IPC: H01P3/08 ,  H01P11/00

Abstract: Structures for a microstrip transmission line and methods of forming a microstrip transmission line. The microstrip transmission line includes a signal line, a shield, and multiple wiring structures connected to the signal line. Each wiring structure extends from a portion of the signal line toward the shield, and each wiring structure includes a metal feature that is positioned adjacent to the shield.

公开(公告)号：US11355409B2

公开(公告)日：2022-06-07

申请号：US16405325

申请日：2019-05-07

Applicant: GlobalFoundries U.S. Inc.

Inventor： Hanyi Ding ,  Vibhor Jain ,  Alvin J. Joseph ,  Anthony K. Stamper

IPC: H01L29/66 ,  H01L23/367 ,  H01L29/08 ,  H01L21/48 ,  H01L29/417 ,  H01L29/732

Abstract: Chip packages and methods of forming a chip package. The chip package includes a power amplifier and a thermal pathway structure configured to influence transport of heat energy. The power amplifier includes a first emitter finger and a second emitter finger having at least one parameter that is selected based upon proximity to the thermal pathway structure.