Invention Grant
- Patent Title: Molded product, metal-clad laminate, printed wiring board, and methods for their production
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Application No.: US16808502Application Date: 2020-03-04
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Publication No.: US11535015B2Publication Date: 2022-12-27
- Inventor: Wataru Kasai , Tomoya Hosoda
- Applicant: AGC Inc.
- Applicant Address: JP Chiyoda-ku
- Assignee: AGC Inc.
- Current Assignee: AGC Inc.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2017-210717 20171031,JPJP2018-147115 20180803
- Main IPC: B32B3/24
- IPC: B32B3/24 ; B32B27/30 ; B32B15/082 ; C08J5/18 ; H05K1/03 ; H05K3/00 ; H05K3/02 ; B32B3/26

Abstract:
To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.
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