Invention Grant
- Patent Title: Apparatus for depositing a substrate and deposition system having the same
-
Application No.: US16898609Application Date: 2020-06-11
-
Publication No.: US11535929B2Publication Date: 2022-12-27
- Inventor: Jeong-Heon Park , Whankyun Kim , Sukhoon Kim , Junho Jeong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2019-0122511 20191002
- Main IPC: C23C14/46
- IPC: C23C14/46 ; H01L21/687 ; H01L21/67 ; H01L21/677

Abstract:
An ion beam deposition apparatus includes a substrate assembly to secure a substrate, a target assembly slanted with respect to the substrate assembly, the target assembly including a target with deposition materials, an ion gun to inject ion beams onto the target, such that ions of the deposition materials are discharged toward the substrate assembly to form a thin layer on the substrate, and a substrate heater to heat the substrate to a deposition temperature higher than a room temperature.
Public/Granted literature
- US20210102285A1 APPARATUS FOR DEPOSITING A SUBSTRATE AND DEPOSITION SYSTEM HAVING THE SAME Public/Granted day:2021-04-08
Information query
IPC分类: