Composition for tin or tin alloy electroplating comprising leveling agent
Abstract:
The present invention relates to the use of an aqueous composition comprising tin ions optionally further alloy metal ions selected from silver, copper, indium, and bismuth ions and at least one additive comprising a linear or branched polyimidazolium compound comprising the structural unit of formula (L1) for depositing tin or tin alloy containing layers and a process for depositing tin alloy layer onto a substrate.
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