A mobile device includes; a PCB including a first side and a second side, a PMIC generating power supply voltages and mounted on the second side of the PCB, a package substrate mounted on the first side of PCB using first interconnects, an IC mounted on the first side of the package substrate, LDO regulators mounted on the second side of the package substrate and disposed between the first interconnects, and high density capacitors disposed between each of the LDO regulators and the second side of the package substrate, wherein the PCB includes first electrical paths connecting the PMIC to the LDO regulators, and the package substrate includes second electrical paths connecting the LDO regulators to the IC.