Invention Grant
- Patent Title: Semiconductor device and semiconductor package including the semiconductor device
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Application No.: US17356080Application Date: 2021-06-23
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Publication No.: US11538506B2Publication Date: 2022-12-27
- Inventor: Hyungjin Kim , Yongjun Kim , Yonghun Kim , Minsu Ahn , Reum Oh , Jinyong Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2020-0090626 20200721,KR10-2020-0160445 20201125
- Main IPC: G11C5/06
- IPC: G11C5/06 ; G11C5/02 ; H01L23/538 ; H01L25/065

Abstract:
A semiconductor device includes a cell area in which a plurality of memory cells are arranged in an array structure, and a peripheral area in which circuits configured to drive the memory cells are arranged, the peripheral area being next to the cell area. The cell area is divided into a plurality of banks, and the plurality of banks comprise first banks having a base size and second banks having a size of 1/(2*n) (wherein n is an integer greater than or equal to 1) of the base size. The plurality of banks are arranged in a first direction and a second direction perpendicular to the first direction, and the semiconductor device has a shape of a rectangular chip which is elongated in the second direction.
Public/Granted literature
- US20220028431A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE Public/Granted day:2022-01-27
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