- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16953261Application Date: 2020-11-19
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Publication No.: US11538772B2Publication Date: 2022-12-27
- Inventor: Cheng-Yu Ho , Meng-Wei Hsieh
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/538 ; H01L21/683 ; H01L21/48 ; H01L21/56 ; H01Q5/307 ; H01Q1/48 ; H01L23/31 ; H01Q1/22 ; H01Q21/06
Abstract:
The present disclosure provides an antenna module. The antenna module includes a first layer, a second layer, a first antenna, and a second antenna. The first layer has a first dielectric constant. The second layer is adjacent to the first layer. The second layer has a second Dk lower than the first Dk. The first antenna is disposed on the first layer and is configured for operating at a first frequency. The second antenna is disposed on the second layer and is configured for operating at a second frequency higher than the first frequency.
Public/Granted literature
- US20220157746A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-05-19
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