Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17231126Application Date: 2021-04-15
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Publication No.: US11538916B2Publication Date: 2022-12-27
- Inventor: Yoontae Hwang , Wandon Kim , Geunwoo Kim , Heonbok Lee , Taegon Kim , Hanki Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2020-0111053 20200901
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L29/78 ; H01L29/417 ; H01L23/532 ; H01L23/485 ; H01L23/522 ; H01L29/66 ; H01L21/285 ; H01L29/08

Abstract:
A semiconductor device including a substrate; a fin active region on the substrate and extending in a first direction; a gate structure extending across the fin active region and extending in a second direction; a source/drain region in the fin active region on a side of the gate structure; an insulating structure covering the gate structure and the source/drain region; and contact structures penetrating through the insulating structure and respectively connected to the source/drain region and the gate structure, wherein one of the contact structures includes a seed layer on the gate structure or the source/drain regions and including lower and upper regions, the lower region having a first grain size and the upper region being amorphous or having a grain size different from the first grain size, and a contact plug on an upper region of the seed layer and having a second grain size.
Public/Granted literature
- US20220069100A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-03-03
Information query
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