A vehicular camera module includes a camera housing, an imager printed circuit board and a processor printed circuit board. An imager is disposed at a first side of the imager printed circuit board. A heat transfer element is accommodated in the camera housing and is in thermal conductive contact with an active cooling element and with a second side of the imager printed circuit board or the processor printed circuit board. Circuitry of the camera module is electrically connected to electrical connecting elements that electrically connect to a wire harness of a vehicle when the vehicular camera module is disposed at the vehicle. With the electrical connecting elements electrically connected to the wire harness of the vehicle, heat generated by operation of the vehicular camera module is drawn from the imager printed circuit board to the camera housing via the heat transfer element.