Invention Grant
- Patent Title: Eartips for coupling via wireform attachment mechanisms
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Application No.: US17207497Application Date: 2021-03-19
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Publication No.: US11540039B2Publication Date: 2022-12-27
- Inventor: Sean T. McIntosh , Jason C. Della Rosa , Samuel G. Parker , Benjamin A. Cousins , Ethan L. Huwe
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H04R1/10
- IPC: H04R1/10 ; G01V3/08 ; A45C11/00 ; A45C13/00 ; E05F1/12 ; E05F3/20 ; H01F7/02 ; H05K5/00 ; H05K5/02 ; H05K5/03 ; H04R1/02 ; H04B1/38 ; H04B1/3827

Abstract:
Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
Public/Granted literature
- US20210211796A1 EARTIPS FOR COUPLING VIA WIREFORM ATTACHMENT MECHANISMS Public/Granted day:2021-07-08
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