Invention Grant
- Patent Title: Gate-all-around (GAA) transistors with shallow source/drain regions and methods of fabricating the same
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Application No.: US16944624Application Date: 2020-07-31
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Publication No.: US11545555B2Publication Date: 2023-01-03
- Inventor: Peijie Feng , Stanley Seungchul Song , Kern Rim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: W&T
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/167 ; H01L29/78 ; H01L29/06

Abstract:
Gate-all-around (GAA) transistors with shallow source/drain regions and methods of fabricating the same provide a GAA transistor that includes one or more channels positioned between a source region and a drain region. The one or more channels, which may be nanowire, nanosheet, or nanoslab semiconductors, are surrounded along a longitudinal axis by gate material. At a first end of the channel is a source region and at an opposite end of the channel is a drain region. To reduce parasitic capacitance between a bottom gate and the source and drain regions, a filler material is provided adjacent the bottom gate, and the source and drain regions are grown on top of the filler material. In this fashion, the bottom gate does not abut the source region or the drain region, reducing geometries which would contribute to parasitic capacitance.
Public/Granted literature
- US20220037493A1 GATE-ALL-AROUND (GAA) TRANSISTORS WITH SHALLOW SOURCE/DRAIN REGIONS AND METHODS OF FABRICATING THE SAME Public/Granted day:2022-02-03
Information query
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