Invention Grant
- Patent Title: High speed flipflop circuit
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Application No.: US17025511Application Date: 2020-09-18
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Publication No.: US11545964B2Publication Date: 2023-01-03
- Inventor: Wonhyun Choi , Hyunchul Hwang , Minsu Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2020-0024550 20200227
- Main IPC: H03K3/037
- IPC: H03K3/037 ; G01R31/3185 ; G01R31/3177 ; G06F1/10 ; H03K3/356

Abstract:
High-speed flipflop circuits are disclosed. The flipflop circuit may latch a data input signal or a scan input signal using a first signal, a second signal, a third signal, and a fourth signal generated inside the flipflop circuit, and may output an output signal and an inverted output signal. The flipflop circuit includes a first signal generation circuit configured to generate the first signal; a second signal generation circuit configured to generate the second signal; a third signal generation circuit configured to receive the second signal and generate the third signal; and an output circuit configured to receive the clock signal and the second signal, and output an output signal and an inverted output signal.
Public/Granted literature
- US20210270899A1 HIGH SPEED FLIPFLOP CIRCUIT Public/Granted day:2021-09-02
Information query
IPC分类: