- Patent Title: Physical layer preamble and signaling for wireless communication
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Application No.: US16988624Application Date: 2020-08-08
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Publication No.: US11546938B2Publication Date: 2023-01-03
- Inventor: Jialing Li Chen , Sameer Vermani , Lin Yang , Bin Tian , Vincent Knowles Jones, IV , Youhan Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Holland & Hart LLP
- Main IPC: H04W74/00
- IPC: H04W74/00 ; H04L5/00 ; H04W72/04 ; H04L69/18 ; H04L69/22 ; H04W84/12

Abstract:
This disclosure provides methods, devices and systems for wireless communication, and particularly, methods, devices and systems for including signaling regarding enhanced features of new wireless communication protocols. The signaling may be included in various portions of a physical layer preamble of a wireless transmission. In some implementations, the physical layer preamble may be used to indicate puncturing of subbands or content channels that may carry further signaling in accordance with preamble signaling designs of this disclosure. The physical layer preamble signaling be parallelized for different subchannels of a wireless channel that consists of multiple subchannels. Some implementations of the physical layer preambles may be used to multiplex different types of wireless local area network communications into different subsets of the plurality of subchannels of the wireless channel.
Public/Granted literature
- US20210045117A1 PHYSICAL LAYER PREAMBLE AND SIGNALING FOR WIRELESS COMMUNICATION Public/Granted day:2021-02-11
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