Invention Grant
- Patent Title: Multilayer board insulating sheet, multilayer board, and method of manufacturing multilayer board
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Application No.: US16813025Application Date: 2020-03-09
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Publication No.: US11546989B2Publication Date: 2023-01-03
- Inventor: Seiko Komatsu , Takaaki Morita , Seiichi Tajima
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2019-068661 20190329
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/03 ; H05K1/09 ; H05K3/46
Abstract:
A multilayer board insulating sheet contains a reducing agent.
Public/Granted literature
- US20200315008A1 MULTILAYER BOARD INSULATING SHEET, MULTILAYER BOARD, AND METHOD OF MANUFACTURING MULTILAYER BOARD Public/Granted day:2020-10-01
Information query
