A lead fixation device for securing a first portion of a lead relative to a hole formed through a skull includes a skull attachment member having an upper surface and a lower surface and a bore extending through and between the upper surface and the lower surface. The lead fixation device also includes a lead compression mechanism integral with the skull attachment member and aligned with the bore of the skull attachment member. The lead compression mechanism defines a passageway through the lead fixation device, which passageway is characterized by a diameter that is defined by the lead compression mechanism. The lead compression mechanism is configured to transition the diameter from a first size to a second size greater than the first size upon insertion of an implant tool through the passageway, and from the second size to the first size upon removal of the implant tool from the passageway.