Invention Grant
- Patent Title: Dielectric composition and capacitor component using the same
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Application No.: US17149538Application Date: 2021-01-14
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Publication No.: US11551871B2Publication Date: 2023-01-10
- Inventor: Jin Sung Chun , Seul Gi Kim , Hyo Kyong Seo , Hae Suk Chung , Byung Sung Kang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0141895 20181116
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/30 ; H01G4/008 ; H01G4/248 ; H01G4/012
Abstract:
A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.
Public/Granted literature
- US20210134528A1 DIELECTRIC COMPOSITION AND CAPACITOR COMPONENT USING THE SAME Public/Granted day:2021-05-06
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