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公开(公告)号:US20230335337A1
公开(公告)日:2023-10-19
申请号:US18211707
申请日:2023-06-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ho In Jun , Kyeong Jun Kim , Jin Sung Chun , Woo Chul Shin , Seul Gi Kim
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.
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公开(公告)号:US20220172892A1
公开(公告)日:2022-06-02
申请号:US17675283
申请日:2022-02-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ho In Jun , Kyeong Jun Kim , Jin Sung Chun , Woo Chul Shin , Seul Gi Kim
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.
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公开(公告)号:US11657966B2
公开(公告)日:2023-05-23
申请号:US17338124
申请日:2021-06-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Kyeong Jun Kim , Ho In Jun , Seul Gi Kim , Jin Sung Chun , Jun Ho Yun
Abstract: A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.
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公开(公告)号:US20210057153A1
公开(公告)日:2021-02-25
申请号:US16776610
申请日:2020-01-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ho In Jun , Kyeong Jun Kim , Jin Sung Chun , Woo Chul Shin , Seul Gi Kim
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.
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公开(公告)号:US12062493B2
公开(公告)日:2024-08-13
申请号:US18211707
申请日:2023-06-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ho In Jun , Kyeong Jun Kim , Jin Sung Chun , Woo Chul Shin , Seul Gi Kim
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.
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公开(公告)号:US11721480B2
公开(公告)日:2023-08-08
申请号:US17675283
申请日:2022-02-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ho In Jun , Kyeong Jun Kim , Jin Sung Chun , Woo Chul Shin , Seul Gi Kim
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.
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公开(公告)号:US11551871B2
公开(公告)日:2023-01-10
申请号:US17149538
申请日:2021-01-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jin Sung Chun , Seul Gi Kim , Hyo Kyong Seo , Hae Suk Chung , Byung Sung Kang
Abstract: A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.
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公开(公告)号:US11538630B2
公开(公告)日:2022-12-27
申请号:US16864728
申请日:2020-05-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Jin Sung Chun , Hae Suk Chung , Byung Sung Kang , Yun Jung Park , Young Hoon Song
IPC: H01G4/12 , H01G4/30 , H01G4/012 , C04B35/626
Abstract: A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.
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公开(公告)号:US11410814B2
公开(公告)日:2022-08-09
申请号:US17176597
申请日:2021-02-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Seul Gi Kim , Jin Sung Chun , Chang Yong Choi
Abstract: A multilayer electronic component includes a body comprising a capacitance-forming portion including a dielectric layer and a plurality of internal electrodes layered with the dielectric layer interposed therebetween, and upper and lower cover portions disposed on upper and lower surfaces of the capacitance-forming portion, respectively; and external electrodes disposed on the body and electrically connected to at least some of the plurality of internal electrodes, respectively, wherein at least one of the upper cover portion and or the lower cover portion has a step structure, and the step structure has a shorter length and width as compared to the capacitance-forming portion.
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公开(公告)号:US11289270B2
公开(公告)日:2022-03-29
申请号:US16776610
申请日:2020-01-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ho In Jun , Kyeong Jun Kim , Jin Sung Chun , Woo Chul Shin , Seul Gi Kim
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.
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