MULTILAYER ELECTRONIC COMPONENT
    2.
    发明申请

    公开(公告)号:US20220172892A1

    公开(公告)日:2022-06-02

    申请号:US17675283

    申请日:2022-02-18

    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

    Multilayer electronic component
    3.
    发明授权

    公开(公告)号:US11657966B2

    公开(公告)日:2023-05-23

    申请号:US17338124

    申请日:2021-06-03

    CPC classification number: H01G4/005 H01G4/248 H01G4/30

    Abstract: A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.

    MULTILAYER ELECTRONIC COMPONENT
    4.
    发明申请

    公开(公告)号:US20210057153A1

    公开(公告)日:2021-02-25

    申请号:US16776610

    申请日:2020-01-30

    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

    Multilayer electronic component
    9.
    发明授权

    公开(公告)号:US11410814B2

    公开(公告)日:2022-08-09

    申请号:US17176597

    申请日:2021-02-16

    Abstract: A multilayer electronic component includes a body comprising a capacitance-forming portion including a dielectric layer and a plurality of internal electrodes layered with the dielectric layer interposed therebetween, and upper and lower cover portions disposed on upper and lower surfaces of the capacitance-forming portion, respectively; and external electrodes disposed on the body and electrically connected to at least some of the plurality of internal electrodes, respectively, wherein at least one of the upper cover portion and or the lower cover portion has a step structure, and the step structure has a shorter length and width as compared to the capacitance-forming portion.

    Multilayer electronic component
    10.
    发明授权

    公开(公告)号:US11289270B2

    公开(公告)日:2022-03-29

    申请号:US16776610

    申请日:2020-01-30

    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

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