Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US17153991Application Date: 2021-01-21
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Publication No.: US11551875B2Publication Date: 2023-01-10
- Inventor: Sim Chung Kang , Eun Jung Lee , Ki Pyo Hong , Yong Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0106001 20180905
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/008 ; H01G4/12

Abstract:
A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes stacked to be alternately exposed to one side surface and the other side surface with the dielectric layer disposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body to be connected to the first and second internal electrodes, respectively, in which the ceramic body includes an area of overlap in a thickness direction of the first and second internal electrodes, margin region, and/or cover region, and the margin region in the width direction and/or the cover region includes a phosphoric acid-based second phase.
Public/Granted literature
- US20210142948A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2021-05-13
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