Invention Grant
- Patent Title: Integrated circuit devices and method of manufacturing the same
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Application No.: US17173784Application Date: 2021-02-11
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Publication No.: US11551972B2Publication Date: 2023-01-10
- Inventor: Jin-yeong Joe , Seok-hoon Kim , Jeong-ho Yoo , Seung-hun Lee , Geun-hee Jeong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0058640 20180523
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/768 ; H01L23/528

Abstract:
An integrated circuit device includes a fin-type active region extending on a substrate in a first direction parallel to a top surface of the substrate; a gate structure extending on the fin-type active region and extending in a second direction parallel to the top surface of the substrate and different from the first direction; and source/drain regions in a recess region extending from one side of the gate structure into the fin-type active region, the source/drain regions including an upper semiconductor layer on an inner wall of the recess region, having a first impurity concentration, and including a gap; and a gap-fill semiconductor layer, which fills the gap and has a second impurity concentration that is greater than the first impurity concentration.
Public/Granted literature
- US20210193516A1 INTEGRATED CIRCUIT DEVICES AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-06-24
Information query
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