Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17043232Application Date: 2019-04-08
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Publication No.: US11552111B2Publication Date: 2023-01-10
- Inventor: Shunpei Yamazaki , Kenichi Okazaki , Masami Jintyou , Yukinori Shima
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JPJP2018-081381 20180420
- International Application: PCT/IB2019/052855 WO 20190408
- International Announcement: WO2019/202430 WO 20191024
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L29/00 ; H01L27/12 ; H01L21/426

Abstract:
A semiconductor device having favorable and stable electrical characteristics is provided. The semiconductor device includes a first and a second transistor over an insulating surface. The first and the second transistors each include a first insulating layer, a semiconductor layer over the first insulating layer, a second insulating layer over the semiconductor layer, and a first conductive layer overlapping with the semiconductor layer with the second insulating layer interposed therebetween. The first insulating layer includes a convex first region that overlaps with the semiconductor layer and a second region that does not and is thinner than the first region. The first conductive layer includes a part over the second region where a lower surface of the first conductive layer is positioned below a lower surface of the semiconductor layer. The second transistor further includes a third conductive layer overlapping with the semiconductor layer with the first insulating layer interposed therebetween.
Public/Granted literature
- US20210020665A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-01-21
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