Invention Grant
- Patent Title: Cable assemblies for headphone devices
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Application No.: US17303881Application Date: 2021-06-09
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Publication No.: US11553269B2Publication Date: 2023-01-10
- Inventor: Ronald W. Roberts, Jr. , Mark Gerlovin , Mark Viscusi
- Applicant: Sonos, Inc.
- Applicant Address: US CA Santa Barbara
- Assignee: Sonos, Inc.
- Current Assignee: Sonos, Inc.
- Current Assignee Address: US CA Santa Barbara
- Agency: Finch & Maloney PLLC
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10 ; H04R1/04 ; H04R5/033 ; H01B7/26

Abstract:
Headphone playback devices can include a cable assembly including a plurality of conductors extending between a first earpiece and a second earpiece. The cable assembly includes a jacket, a power conductor disposed within the jacket and coupled between a power source in the first earpiece and a wireless transceiver in the second earpiece. The cable assembly further includes a microphone conductor at least partially disposed within the jacket and coupled to a microphone in one of the earpieces. A shield is at least partially disposed between the power conductor and the microphone conductor to reduce electromagnetic interference between the two.
Public/Granted literature
- US20210400372A1 CABLE ASSEMBLIES FOR HEADPHONE DEVICES Public/Granted day:2021-12-23
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