Invention Grant
- Patent Title: Molding powder
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Application No.: US17081446Application Date: 2020-10-27
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Publication No.: US11555098B2Publication Date: 2023-01-17
- Inventor: Hirokazu Komori , Junpei Terada , Hiroyuki Sendan , Tadahiro Yabu , Yukihiro Fukagawa , Kenta Murayama , Tomohiro Shiromaru , Toshio Miyatani , Masahiro Kondou , Hiroyuki Hamada
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2018-087406 20180427
- Main IPC: C08K3/36
- IPC: C08K3/36 ; B33Y70/00 ; B29C64/314 ; B29C64/153 ; B29K27/18
Abstract:
A shaping material for a powder bed fusion method, including a powder of a fluororesin, wherein the fluororesin has a D50 of 30 μm or more and 200 μm or less, and the fluororesin has a D10 of 12 μm or more.
Public/Granted literature
- US20210047497A1 MOLDING POWDER Public/Granted day:2021-02-18
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