- 专利标题: Thickness measurement of substrate using color metrology
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申请号: US16388777申请日: 2019-04-18
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公开(公告)号: US11557048B2公开(公告)日: 2023-01-17
- 发明人: Dominic J. Benvegnu , Boguslaw A. Swedek
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Fish & Richardson P.C.
- 主分类号: G06T7/40
- IPC分类号: G06T7/40 ; G06T7/90 ; H04N5/247 ; H04N5/225 ; H04N9/04 ; B24B37/013 ; G06T7/00
摘要:
A system for obtaining a measurement representative of a thickness of a layer on a substrate includes a support to hold a substrate, an optical assembly to capture two color images with light impinging the substrate at different angles of incidence, and a controller. The controller is configured to store a function that provides a value representative of a thickness as a function of position along a predetermined path in a coordinate space of at least four dimensions. For a pixel in the two color images, the controller determines a coordinate in the coordinate space from the color data, determines a position of a point on the predetermined path that is closest to the coordinate, and calculates a value representative of a thickness from the function and the position of the point on the predetermined path.
公开/授权文献
- US20190244374A1 THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY 公开/授权日:2019-08-08
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