中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

112 records (took 0.031 seconds)

    SEMICONDUCTOR FILM THICKNESS PREDICTION USING MACHINE-LEARNING
    1.
    发明公开
    SEMICONDUCTOR FILM THICKNESS PREDICTION USING MACHINE-LEARNING 审中-公开

    公开(公告)号：US20240185058A1

    公开(公告)日：2024-06-06

    申请号：US18075216

    申请日：2022-12-05

    Applicant: Applied Materials, Inc.

    Inventor： Nojan Motamedi ,  Dominic J. Benvegnu ,  Kiran L. Shrestha

    IPC: G06N3/08

    CPC classification number: G06N3/08

    Abstract: A machine-learning model may be used to estimate a film thickness from a spectral image captured from a semiconductor substrate during processing. Instead of using actual measurements from physical substrates to train the model, simulated images may be generated for a wide variety of predefined thickness profiles. Simulated training data may be rapidly generated by receiving a film thickness profile representing a film on a semiconductor substrate design. A light source may be simulated being reflected off of the film on the semiconductor substrate and being captured by a camera. The spectral data captured by the camera may be converted into one or more images for a wafer with the film thickness profile. The images may then be labeled with thicknesses from the film thickness profile for training a machine-learning model.

    Thickness measurement of substrate using color metrology
    7.
    发明授权
    Thickness measurement of substrate using color metrology 有权

    公开(公告)号：US11017524B2

    公开(公告)日：2021-05-25

    申请号：US16435291

    申请日：2019-06-07

    Applicant: Applied Materials, Inc.

    Inventor： Dominic J. Benvegnu

    IPC: G06T7/00 ,  G06T7/90 ,  B24B37/013 ,  H01L21/67 ,  H01L21/677 ,  H04N5/225 ,  H04N9/07

    Abstract: A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.

    Thickness Measurement of Substrate Using Color Metrology
    9.
    发明申请
    Thickness Measurement of Substrate Using Color Metrology 审中-公开

    公开(公告)号：US20200258214A1

    公开(公告)日：2020-08-13

    申请号：US16414709

    申请日：2019-05-16

    Applicant: Applied Materials, Inc.

    Inventor： Nojan Motamedi ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Martin A. Josefowicz

    IPC: G06T7/00 ,  G06T5/00 ,  H01L21/67 ,  G01B11/06

    Abstract: A layer thickness measurement system includes a support to hold a substrate, an optical sensor to capture a color image of at least a portion of the substrate, and a controller. The controller is configured to receive the color image from the optical sensor, store a function that provides a value representative of a thickness as a function of position along a predetermined path in a coordinate space of at least two dimensions including a first color channel and a second color channel, for a pixel of the color image determine a coordinate of the pixel in the coordinate space from color data in the color image, determine a position of a point on the predetermined path that is closest to the coordinate, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.

Patent Agency Ranking