Invention Grant
- Patent Title: Thickness measurement of substrate using color metrology
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Application No.: US16388777Application Date: 2019-04-18
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Publication No.: US11557048B2Publication Date: 2023-01-17
- Inventor: Dominic J. Benvegnu , Boguslaw A. Swedek
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: G06T7/40
- IPC: G06T7/40 ; G06T7/90 ; H04N5/247 ; H04N5/225 ; H04N9/04 ; B24B37/013 ; G06T7/00

Abstract:
A system for obtaining a measurement representative of a thickness of a layer on a substrate includes a support to hold a substrate, an optical assembly to capture two color images with light impinging the substrate at different angles of incidence, and a controller. The controller is configured to store a function that provides a value representative of a thickness as a function of position along a predetermined path in a coordinate space of at least four dimensions. For a pixel in the two color images, the controller determines a coordinate in the coordinate space from the color data, determines a position of a point on the predetermined path that is closest to the coordinate, and calculates a value representative of a thickness from the function and the position of the point on the predetermined path.
Public/Granted literature
- US20190244374A1 THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY Public/Granted day:2019-08-08
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