Invention Grant
- Patent Title: Flip-chip flexible under bump metallization size
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Application No.: US16917295Application Date: 2020-06-30
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Publication No.: US11557557B2Publication Date: 2023-01-17
- Inventor: Yangyang Sun , Dongming He , Lily Zhao
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
Disclosed is a flip-chip device. The flip-chip device includes a die having a plurality of under bump metallizations (UBMs); and a package substrate having a plurality of bond pads. The plurality of UBMs include a first set of UBMs having a first size and a first minimum pitch and a second set of UBMs having a second size and a second minimum pitch. The first set of UBMs and the second set of UBMs are each electrically coupled to the package substrate by a bond-on-pad connection.
Public/Granted literature
- US20210407939A1 FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE Public/Granted day:2021-12-30
Information query
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