Invention Grant
- Patent Title: Image module package having glass filter secured by transparent adhesive
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Application No.: US17155258Application Date: 2021-01-22
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Publication No.: US11562992B2Publication Date: 2023-01-24
- Inventor: Chee-Pin T'Ng , Sai-Mun Lee
- Applicant: PixArt Imaging Inc.
- Applicant Address: TW Hsin-Chu County
- Assignee: PixArt Imaging Inc.
- Current Assignee: PixArt Imaging Inc.
- Current Assignee Address: TW Hsin-Chu County
- Agency: WPAT, PC
- Main IPC: H01L25/16
- IPC: H01L25/16 ; G01J1/02 ; G01S7/481 ; H01L25/00 ; G01J3/02 ; G01J3/10 ; G01S17/04
Abstract:
There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
Public/Granted literature
- US20210143139A1 IMAGE MODULE PACKAGE HAVING GLASS FILTER SECURED BY TRANSPARENT ADHESIVE Public/Granted day:2021-05-13
Information query
IPC分类:
