Invention Grant
- Patent Title: Anti-slippery stamp landing ring
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Application No.: US17579349Application Date: 2022-01-19
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Publication No.: US11567417B2Publication Date: 2023-01-31
- Inventor: Jing Jiang , Suraj Yadav , Amita Joshi , Vivian Hsu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G02B6/26
Abstract:
Apparatus and methods of performing nanoimprint lithography using an anti-slip landing ring are provided. In one embodiment, a process chamber for nanoimprint lithography is provided and includes a substrate support and a ring disposed on the substrate support. The ring has a top surface opposite the substrate support, and the top surface has a grid pattern. A bottom surface facing the substrate support has a different pattern compared to the grid pattern.
Public/Granted literature
- US20220229370A1 ANTI-SLIPPERY STAMP LANDING RING Public/Granted day:2022-07-21
Information query
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