Invention Grant
- Patent Title: Apparatuses including passing word lines comprising a band offset material, and related methods and systems
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Application No.: US17165753Application Date: 2021-02-02
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Publication No.: US11569353B2Publication Date: 2023-01-31
- Inventor: Venkata Naveen Kumar Neelapala , Deepak Chandra Pandey
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/165
Abstract:
An apparatus comprises active word lines extending within a semiconductive material, passing word lines extending adjacent to the active word lines within the semiconductive material, isolation regions adjacent to the passing word lines, and a band offset material adjacent to the passing word lines and the isolation regions. The semiconductive material exhibits a first bandgap and the band offset material exhibits a second, different bandgap. Related methods and systems are also described.
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Information query
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