Invention Grant
- Patent Title: Packaging structure, packaging method and display apparatus
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Application No.: US17256085Application Date: 2020-04-17
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Publication No.: US11575107B2Publication Date: 2023-02-07
- Inventor: Wenbin Jia , Xinwei Gao , Peng Li
- Applicant: HEFEI BOE JOINT TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Anhui; CN Bejing
- Assignee: HEFEI BOE JOINT TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: HEFEI BOE JOINT TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Anhui; CN Bejing
- Agency: Fay Sharpe LLP
- Priority: CN201910431420.8 20190522
- International Application: PCT/CN2020/085315 WO 20200417
- International Announcement: WO2020/233298 WO 20201126
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56

Abstract:
A packaging structure, a packaging method, and a display apparatus are disclosed. The packaging structure includes: a first substrate and a second substrate opposite to each other; a plurality of first sealing frames located between the first substrate and the second substrate, wherein the first substrate, the second substrate and the plurality of first sealing frames enclose a plurality of sealed cavities not communicating with each other, and each of the sealed cavities is configured to package at least one to-be-packaged unit of a to-be-packaged device; and a first filler located in the sealed cavity.
Public/Granted literature
- US20210226150A1 PACKAGING STRUCTURE, PACKAGING METHOD AND DISPLAY APPARATUS Public/Granted day:2021-07-22
Information query
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