Invention Grant
- Patent Title: Memory device with embedded sim card
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Application No.: US16954981Application Date: 2018-03-06
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Publication No.: US11580346B2Publication Date: 2023-02-14
- Inventor: Xiaofeng Sheng
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/CN2018/078112 WO 20180306
- International Announcement: WO2019/169543 WO 20190912
- Main IPC: G06K19/077
- IPC: G06K19/077 ; H01R12/72 ; H01R13/66 ; H04B1/3816

Abstract:
Embodiments of the present disclosure are directed towards a memory device removably couplable with a mobile device. In some embodiments, the memory device may include a PCB insertable in the mobile device. The PCB may include a first chip (a micro SD device); a second chip (a SIM card); a first contact electrically coupled with the first chip, to provide a first communication interface between the first chip and the mobile device; and a second contact electrically coupled with the second chip, to provide a second communication interface between the second chip and the mobile device. The first and second communication interfaces may provide for respective communications between the micro SD device and the mobile device, and between the SIM card and the mobile device, at the same time, when the PCB is removably coupled with the mobile device.
Public/Granted literature
- US20200380330A1 A MEMORY DEVICE WITH EMBEDDED SIM CARD Public/Granted day:2020-12-03
Information query