- Patent Title: Package comprising inter-substrate gradient interconnect structure
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Application No.: US17093954Application Date: 2020-11-10
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Publication No.: US11581251B2Publication Date: 2023-02-14
- Inventor: Aniket Patil , Zhijie Wang , Joan Rey Villarba Buot , Hong Bok We
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/495 ; H01L25/10 ; H01L25/00
Abstract:
A device comprising a first package and a second package coupled to the first package. The first package includes a first substrate, at least one gradient interconnect structure coupled to the first substrate, and a first integrated device coupled to the first substrate. The second package includes a second substrate and a second integrated device coupled to the second substrate. The second substrate is coupled to the at least one gradient interconnect structure.
Public/Granted literature
- US20220148952A1 PACKAGE COMPRISING INTER-SUBSTRATE GRADIENT INTERCONNECT STRUCTURE Public/Granted day:2022-05-12
Information query
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